Sherief Reda, Gregory Smith 0002, Larry Smith 0004. Maximizing the Functional Yield of Wafer-to-Wafer 3-D Integration. IEEE Trans. VLSI Syst., 17(9):1357-1362, 2009. [doi]
@article{Reda0009,
title = {Maximizing the Functional Yield of Wafer-to-Wafer 3-D Integration},
author = {Sherief Reda and Gregory Smith 0002 and Larry Smith 0004},
year = {2009},
doi = {10.1109/TVLSI.2008.2003513},
url = {http://dx.doi.org/10.1109/TVLSI.2008.2003513},
researchr = {https://researchr.org/publication/Reda0009},
cites = {0},
citedby = {0},
journal = {IEEE Trans. VLSI Syst.},
volume = {17},
number = {9},
pages = {1357-1362},
}