Maximizing the Functional Yield of Wafer-to-Wafer 3-D Integration

Sherief Reda, Gregory Smith 0002, Larry Smith 0004. Maximizing the Functional Yield of Wafer-to-Wafer 3-D Integration. IEEE Trans. VLSI Syst., 17(9):1357-1362, 2009. [doi]

Abstract

Abstract is missing.