A Framework for TSV Based 3D-IC to Analyze Aging and TSV Thermo-Mechanical Stress on Soft Errors - researchr publication authors

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Raviteja P. Reddy, Amit Acharyya, S. Saqib Khursheed. A Framework for TSV Based 3D-IC to Analyze Aging and TSV Thermo-Mechanical Stress on Soft Errors. In IEEE International Test Conference in Asia, ITC-Asia 2019, Tokyo, Japan, September 3-5, 2019. pages 121-126, IEEE, 2019. [doi]

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