Raviteja P. Reddy, Amit Acharyya, S. Saqib Khursheed. A Framework for TSV Based 3D-IC to Analyze Aging and TSV Thermo-Mechanical Stress on Soft Errors. In IEEE International Test Conference in Asia, ITC-Asia 2019, Tokyo, Japan, September 3-5, 2019. pages 121-126, IEEE, 2019. [doi]
@inproceedings{ReddyAK19,
title = {A Framework for TSV Based 3D-IC to Analyze Aging and TSV Thermo-Mechanical Stress on Soft Errors},
author = {Raviteja P. Reddy and Amit Acharyya and S. Saqib Khursheed},
year = {2019},
doi = {10.1109/ITC-Asia.2019.00034},
url = {https://doi.org/10.1109/ITC-Asia.2019.00034},
researchr = {https://researchr.org/publication/ReddyAK19},
cites = {0},
citedby = {0},
pages = {121-126},
booktitle = {IEEE International Test Conference in Asia, ITC-Asia 2019, Tokyo, Japan, September 3-5, 2019},
publisher = {IEEE},
isbn = {978-1-7281-4718-5},
}