TSV noise coupling in 3D IC using guard ring

R. Ranga Reddy, Sugandh Tanna, Shiv Govind Singh, Om Krishna Singh. TSV noise coupling in 3D IC using guard ring. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]

Authors

R. Ranga Reddy

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Sugandh Tanna

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Shiv Govind Singh

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Om Krishna Singh

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