R. Ranga Reddy, Sugandh Tanna, Shiv Govind Singh, Om Krishna Singh. TSV noise coupling in 3D IC using guard ring. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]
@inproceedings{ReddyTSS15,
title = {TSV noise coupling in 3D IC using guard ring},
author = {R. Ranga Reddy and Sugandh Tanna and Shiv Govind Singh and Om Krishna Singh},
year = {2015},
doi = {10.1109/3DIC.2015.7334606},
url = {http://dx.doi.org/10.1109/3DIC.2015.7334606},
researchr = {https://researchr.org/publication/ReddyTSS15},
cites = {0},
citedby = {0},
booktitle = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015},
publisher = {IEEE},
isbn = {978-1-4673-9385-0},
}