Application of Machine Learning for Quality Risk Factor Analysis of Electronic Assemblies

Brendan Reidy, David Duggan, Bernard Glasauer, Peng Su, Ramtin Zand. Application of Machine Learning for Quality Risk Factor Analysis of Electronic Assemblies. In 24th International Symposium on Quality Electronic Design, ISQED 2023, San Francisco, CA, USA, April 5-7, 2023. pages 1-6, IEEE, 2023. [doi]

Abstract

Abstract is missing.