Postbond Test of Through-Silicon Vias With Resistive Open Defects

Rosa Rodríguez-Montañés, Daniel Arumí, Joan Figueras. Postbond Test of Through-Silicon Vias With Resistive Open Defects. IEEE Trans. VLSI Syst., 27(11):2596-2607, 2019. [doi]

Abstract

Abstract is missing.