Mario Rotigni, Mauro Merlo, Martina Cordoni, Paolo Colombo, Valentino Liberali. Role of IC substrate and ESD protections in noise propagation: Design and modelling of dedicated test chip in 40 nm technology. In 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2015, Edinburgh, UK, November 10-13, 2015. pages 97-102, IEEE, 2015. [doi]
@inproceedings{RotigniMCCL15, title = {Role of IC substrate and ESD protections in noise propagation: Design and modelling of dedicated test chip in 40 nm technology}, author = {Mario Rotigni and Mauro Merlo and Martina Cordoni and Paolo Colombo and Valentino Liberali}, year = {2015}, doi = {10.1109/EMCCompo.2015.7358338}, url = {https://doi.org/10.1109/EMCCompo.2015.7358338}, researchr = {https://researchr.org/publication/RotigniMCCL15}, cites = {0}, citedby = {0}, pages = {97-102}, booktitle = {10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2015, Edinburgh, UK, November 10-13, 2015}, publisher = {IEEE}, isbn = {978-1-4673-7897-0}, }