Surajit Kumar Roy, Sobitri Chatterjee, Chandan Giri, Hafizur Rahaman. Faulty TSVs identification and recovery in 3D stacked ICs during pre-bond testing. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-6, IEEE, 2013. [doi]
Abstract is missing.