Optimizing Test Wrapper for Embedded Cores Using TSV Based 3D SOCs

Surajit Kumar Roy, Chandan Giri, Sourav Ghosh, Hafizur Rahaman. Optimizing Test Wrapper for Embedded Cores Using TSV Based 3D SOCs. In IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2011, 4-6 July 2011, Chennai, India. pages 31-36, IEEE Computer Society, 2011. [doi]

@inproceedings{RoyGGR11,
  title = {Optimizing Test Wrapper for Embedded Cores Using TSV Based 3D SOCs},
  author = {Surajit Kumar Roy and Chandan Giri and Sourav Ghosh and Hafizur Rahaman},
  year = {2011},
  doi = {10.1109/ISVLSI.2011.33},
  url = {http://dx.doi.org/10.1109/ISVLSI.2011.33},
  tags = {optimization, rule-based, testing},
  researchr = {https://researchr.org/publication/RoyGGR11},
  cites = {0},
  citedby = {0},
  pages = {31-36},
  booktitle = {IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2011, 4-6 July 2011, Chennai, India},
  publisher = {IEEE Computer Society},
}