Arijit Roy, Yuejin Hou, Cher Ming Tan. Electromigration in width transition copper interconnect. Microelectronics Reliability, 49(9-11):1086-1089, 2009. [doi]
@article{RoyHT09,
title = {Electromigration in width transition copper interconnect},
author = {Arijit Roy and Yuejin Hou and Cher Ming Tan},
year = {2009},
doi = {10.1016/j.microrel.2009.06.038},
url = {http://dx.doi.org/10.1016/j.microrel.2009.06.038},
researchr = {https://researchr.org/publication/RoyHT09},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {49},
number = {9-11},
pages = {1086-1089},
}