Cher Ming Tan - researchr alias

Electromigration in ULSI InterconnectionsCher Ming Tan. International Series on Advances in Solid State Electronics and Technology, World Scientific, 2010. [doi]

Humidity study of a-Si PV cellCher Ming Tan, Boon Khai Eric Chen, Kok Peng Toh. mr, 50(9-11):1871-1874, 2010. [doi]

Electromigration performance of Through Silicon Via (TSV) - A modeling approachY. C. Tan, Cher Ming Tan, Xiaowu Zhang, Tai-Chong Chai, D. Q. Yu. mr, 50(9-11):1336-1340, 2010. [doi]

2009

Behavior of hot carrier generation in power SOI LDNMOS with shallow trench isolation (STI)Jie Liao, Cher Ming Tan, Geert Spierings. mr, 49(9-11):1038-1043, 2009. [doi]

Electromigration in width transition copper interconnectArijit Roy, Yuejin Hou, Cher Ming Tan. mr, 49(9-11):1086-1089, 2009. [doi]

Analysis of humidity effects on the degradation of high-power white LEDsCher Ming Tan, Boon Khai Eric Chen, Gan Xu, Yuanjie Liu. mr, 49(9-11):1226-1230, 2009. [doi]

Reply to comments on "A framework to practical predictive maintenance modeling for multi-state systems"Cher Ming Tan, Nagarajan Raghavan. ress, 94(3):781-782, 2009. [doi]

2008

Reverse Breakdown Voltage Measurement for Power P:::+:::NN:::+::: RectifierGuangyu Huang, Cher Ming Tan. et, 24(5):473-479, 2008. [doi]

A framework to practical predictive maintenance modeling for multi-state systemsCher Ming Tan, Nagarajan Raghavan. ress, 93(8):1138-1150, 2008. [doi]

2007

Enhanced finite element modelling of Cu electromigration using ANSYS and matlabWei Li, Cher Ming Tan. mr, 47(9-11):1497-1501, 2007. [doi]

Room temperature observation of point defect on gold surface using thermovoltage mappingArijit Roy, Cher Ming Tan, Sean J. O Shea, Kedar Hippalgaonkar, Wulf Hofbauer. mr, 47(9-11):1580-1584, 2007. [doi]

Finite element modeling of capacitive coupling voltage contrastCher Ming Tan, Stanny Yanuar, Tai-Chong Chai. mr, 47(9-11):1555-1560, 2007. [doi]

An approach to statistical analysis of gate oxide breakdown mechanismsCher Ming Tan, Nagarajan Raghavan. mr, 47(9-11):1336-1342, 2007. [doi]

2006

Device level electrical-thermal-stress coupled-field modelingGuang Yu Huang, Cher Ming Tan. mr, 46(9-11):1823-1827, 2006. [doi]

Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnectArijit Roy, Cher Ming Tan. mr, 46(9-11):1652-1656, 2006. [doi]

Feasibility study of the application of voltage contrast to printed circuit boardCher Ming Tan, Zhenghao Gan, Tai-Chong Chai. mr, 46(5-6):939-948, 2006. [doi]

Development of highly accelerated electromigration testCher Ming Tan, Wei Li, Kok Tong Tan, Frankie Low. mr, 46(9-11):1638-1642, 2006. [doi]

2005

Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structuresArijit Roy, Cher Ming Tan, Rakesh Kumar, Xian Tong Chen. mr, 45(9-11):1443-1448, 2005. [doi]

Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resistCher Ming Tan, Kim Peng Lim, Tai-Chong Chai, Guat Cheng Lim. mr, 45(9-11):1572-1575, 2005. [doi]

Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applicationsCher Ming Tan, Zhenghao Gan, Wai Fung Ho, Sam Chen, Robert Liu. mr, 45(1):179-184, 2005. [doi]

Reliability screening through electrical testing for press-fit alternator power diode in automotive applicationCher Ming Tan, Joe Chiu, Robert Liu, Guan Zhang. mr, 45(9-11):1723-1727, 2005. [doi]

Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnectsCher Ming Tan, Arijit Roy, Kok Tong Tan, Derek Sim Kwang Ye, Frankie Low. mr, 45(9-11):1449-1454, 2005. [doi]

2004

Reliability Improvement in Al Metallization: A Combination of Statistical Prediction and Failure Analytical MethodologyGuan Zhang, Cher Ming Tan, Kok Tong Tan, Derek Sim Kwang Ye, W. Y. Zhang. mr, 44(9-11):1843-1848, 2004. [doi]

2001

A Reliability Statistics Perspective on the Pitfalls of Standard Wafer-Level Electromigration Accelerated Test (SWEAT)Cher Ming Tan, Kelvin Ngan Chong Yeo. et, 17(1):63-68, 2001. [doi]

1999

Using power diode models for circuit simulations-a comprehensive reviewCher Ming Tan, King-Jet Tseng. tie, 46(3):637-645, 1999. [doi]

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