Surajit Kumar Roy, Kaustav Roy, Chandan Giri, Hafizur Rahaman. Recovery of faulty TSVs in 3D ICs. In Sixteenth International Symposium on Quality Electronic Design, ISQED 2015, Santa Clara, CA, USA, March 2-4, 2015. pages 533-536, IEEE, 2015. [doi]
@inproceedings{RoyRGR15,
title = {Recovery of faulty TSVs in 3D ICs},
author = {Surajit Kumar Roy and Kaustav Roy and Chandan Giri and Hafizur Rahaman},
year = {2015},
doi = {10.1109/ISQED.2015.7085482},
url = {http://dx.doi.org/10.1109/ISQED.2015.7085482},
researchr = {https://researchr.org/publication/RoyRGR15},
cites = {0},
citedby = {0},
pages = {533-536},
booktitle = {Sixteenth International Symposium on Quality Electronic Design, ISQED 2015, Santa Clara, CA, USA, March 2-4, 2015},
publisher = {IEEE},
isbn = {978-1-4799-7581-5},
}