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Surajit Kumar Roy, Kaustav Roy, Chandan Giri, Hafizur Rahaman. Recovery of faulty TSVs in 3D ICs. In Sixteenth International Symposium on Quality Electronic Design, ISQED 2015, Santa Clara, CA, USA, March 2-4, 2015. pages 533-536, IEEE, 2015. [doi]
Possibly Related PublicationsThe following publications are possibly variants of this publication: Faulty TSVs identification and recovery in 3D stacked ICs during pre-bond testingSurajit Kumar Roy, Sobitri Chatterjee, Chandan Giri, Hafizur Rahaman. 3dic 2013: 1-6 [doi] TSV repairing for 3D ICs using redundant TSVSudeep Ghosh, Surajit Kumar Roy, Hafizur Rahaman, Chandan Giri. ised 2017: 1-5 [doi]
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