Heba Saadeldeen, Zhaoxia Deng, Timothy Sherwood, Frederic T. Chong. Thermal-aware, heterogeneous materials for improved energy and reliability in 3D PCM architectures. In Proceedings of the International Symposium on Memory Systems, MEMSYS 2017, Alexandria, VA, USA, October 02 - 05, 2017. pages 223-236, ACM, 2017. [doi]
Abstract is missing.