D. K. Sadana, C. W. Cheng, B. Wacaser, W. Spratt, K. T. Shiu, Stephen W. Bedell. Materials challenges for III-V/Si co-integrated CMOS. In 2015 IEEE Custom Integrated Circuits Conference, CICC 2015, San Jose, CA, USA, September 28-30, 2015. pages 1-6, IEEE, 2015. [doi]
@inproceedings{SadanaCWSSB15,
title = {Materials challenges for III-V/Si co-integrated CMOS},
author = {D. K. Sadana and C. W. Cheng and B. Wacaser and W. Spratt and K. T. Shiu and Stephen W. Bedell},
year = {2015},
doi = {10.1109/CICC.2015.7338398},
url = {http://dx.doi.org/10.1109/CICC.2015.7338398},
researchr = {https://researchr.org/publication/SadanaCWSSB15},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {2015 IEEE Custom Integrated Circuits Conference, CICC 2015, San Jose, CA, USA, September 28-30, 2015},
publisher = {IEEE},
isbn = {978-1-4799-8682-8},
}