Materials challenges for III-V/Si co-integrated CMOS

D. K. Sadana, C. W. Cheng, B. Wacaser, W. Spratt, K. T. Shiu, Stephen W. Bedell. Materials challenges for III-V/Si co-integrated CMOS. In 2015 IEEE Custom Integrated Circuits Conference, CICC 2015, San Jose, CA, USA, September 28-30, 2015. pages 1-6, IEEE, 2015. [doi]

Abstract

Abstract is missing.