Mehdi Saedi, Kambiz Samadi, Arpit Mittal, Rajat Mittal. Thermal implications of mobile 3D-ICs. In 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014. pages 1-7, IEEE, 2014. [doi]
@inproceedings{SaediSMM14,
title = {Thermal implications of mobile 3D-ICs},
author = {Mehdi Saedi and Kambiz Samadi and Arpit Mittal and Rajat Mittal},
year = {2014},
doi = {10.1109/3DIC.2014.7152160},
url = {http://dx.doi.org/10.1109/3DIC.2014.7152160},
researchr = {https://researchr.org/publication/SaediSMM14},
cites = {0},
citedby = {0},
pages = {1-7},
booktitle = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014},
publisher = {IEEE},
isbn = {978-1-4799-8472-5},
}