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Multi-objective Optimization of Placement and Assignment of TSVs in 3D ICs

Debasri Saha, Susmita Sur-Kolay. Multi-objective Optimization of Placement and Assignment of TSVs in 3D ICs. In 30th International Conference on VLSI Design and 16th International Conference on Embedded Systems, VLSID 2017, Hyderabad, India, January 7-11, 2017. pages 372-377, IEEE Computer Society, 2017. [doi]

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