Leak-Proof Packaging for GaN Chip with Controlled Thermal Spreading and Transients - researchr publication authors

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Yasuo Saito, Tatsuhiko Aizawa, Kenji Wasa, Yoshiro Nogami. Leak-Proof Packaging for GaN Chip with Controlled Thermal Spreading and Transients. In 2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), San Diego, CA, USA, October 15-17, 2018. pages 243-246, IEEE, 2018. [doi]

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