Yasuo Saito, Tatsuhiko Aizawa, Kenji Wasa, Yoshiro Nogami. Leak-Proof Packaging for GaN Chip with Controlled Thermal Spreading and Transients. In 2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), San Diego, CA, USA, October 15-17, 2018. pages 243-246, IEEE, 2018. [doi]
@inproceedings{SaitoAWN18,
title = {Leak-Proof Packaging for GaN Chip with Controlled Thermal Spreading and Transients},
author = {Yasuo Saito and Tatsuhiko Aizawa and Kenji Wasa and Yoshiro Nogami},
year = {2018},
doi = {10.1109/BCICTS.2018.8551037},
url = {https://doi.org/10.1109/BCICTS.2018.8551037},
researchr = {https://researchr.org/publication/SaitoAWN18},
cites = {0},
citedby = {0},
pages = {243-246},
booktitle = {2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), San Diego, CA, USA, October 15-17, 2018},
publisher = {IEEE},
isbn = {978-1-5386-6502-2},
}