Koji Sakui, Takayuki Ohba. High Bandwidth Memory (HBM) and High Bandwidth NAND (HBN) with the Bumpless TSV Technology. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-4, IEEE, 2019. [doi]
@inproceedings{SakuiO19-0,
title = {High Bandwidth Memory (HBM) and High Bandwidth NAND (HBN) with the Bumpless TSV Technology},
author = {Koji Sakui and Takayuki Ohba},
year = {2019},
doi = {10.1109/3DIC48104.2019.9058900},
url = {https://doi.org/10.1109/3DIC48104.2019.9058900},
researchr = {https://researchr.org/publication/SakuiO19-0},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019},
publisher = {IEEE},
isbn = {978-1-7281-4870-0},
}