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High Bandwidth Memory (HBM) and High Bandwidth NAND (HBN) with the Bumpless TSV Technology

Koji Sakui, Takayuki Ohba. High Bandwidth Memory (HBM) and High Bandwidth NAND (HBN) with the Bumpless TSV Technology. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-4, IEEE, 2019. [doi]

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