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Khaled Salah. Performance comparison between air-gap based coaxial TSV and conventional circular TSV in 3D-ICs. In 8th International Design and Test Symposium, IDT 2013, Marrakesh, Morocco, 16-18 December, 2013. pages 1-3, IEEE, 2013. [doi]
Possibly Related PublicationsThe following publications are possibly variants of this publication: Design of adiabatic TSV, SWCNT TSV, and Air-Gap Coaxial TSVKhaled Salah, Yehea I. Ismail. iscas 2015: 1953-1956 [doi] Analysis of coupling capacitance between TSVs and metal interconnects in 3D-ICsKhaled Salah. icecsys 2012: 745-748 [doi] Compact lumped element model for TSV in 3D-ICsKhaled Salah, Alaa El Rouby, Hani Ragai, Karim Amin, Yehea I. Ismail. iscas 2011: 2321-2324 [doi]
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