A TSV to TSV, A TSV to Metal interconnects, and A TSV to active device coupling capacitance: Analysis and recommendations - researchr publication

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Khaled Salah. A TSV to TSV, A TSV to Metal interconnects, and A TSV to active device coupling capacitance: Analysis and recommendations. In 10th International Conference on Design & Technology of Integrated Systems in Nanoscale Era, DTIS 2015, Napoli, Italy, April 21-23, 2015. pages 1-2, IEEE, 2015. [doi]

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