A novel dimensional analysis method for TSV modeling and analysis in three dimensional integrated circuits - researchr publication authors

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Khaled Salah, Yehea I. Ismail. A novel dimensional analysis method for TSV modeling and analysis in three dimensional integrated circuits. In IEEE International Symposium on Circuits and Systemss, ISCAS 2014, Melbourne, Victoria, Australia, June 1-5, 2014. pages 2764-2767, IEEE, 2014. [doi]

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