Khaled Salah, Yehea I. Ismail. A novel dimensional analysis method for TSV modeling and analysis in three dimensional integrated circuits. In IEEE International Symposium on Circuits and Systemss, ISCAS 2014, Melbourne, Victoria, Australia, June 1-5, 2014. pages 2764-2767, IEEE, 2014. [doi]
@inproceedings{SalahI14,
title = {A novel dimensional analysis method for TSV modeling and analysis in three dimensional integrated circuits},
author = {Khaled Salah and Yehea I. Ismail},
year = {2014},
doi = {10.1109/ISCAS.2014.6865746},
url = {http://dx.doi.org/10.1109/ISCAS.2014.6865746},
researchr = {https://researchr.org/publication/SalahI14},
cites = {0},
citedby = {0},
pages = {2764-2767},
booktitle = {IEEE International Symposium on Circuits and Systemss, ISCAS 2014, Melbourne, Victoria, Australia, June 1-5, 2014},
publisher = {IEEE},
}