In-situ X-ray μLaue diffraction study of copper through-silicon vias - researchr publication authors

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Dario Ferreira Sanchez, Shay Reboh, Monica Larissa Djomeni Weleguela, Jean-Sébastien Micha, Odile Robach, Thierry Mourier, Patrice Gergaud, Pierre Bleuet. In-situ X-ray μLaue diffraction study of copper through-silicon vias. Microelectronics Reliability, 56:78-84, 2016. [doi]

This author has not been identified. Look up 'Dario Ferreira Sanchez' in GoogleThis author has not been identified. Look up 'Shay Reboh' in GoogleThis author has not been identified. Look up 'Monica Larissa Djomeni Weleguela' in GoogleThis author has not been identified. Look up 'Jean-Sébastien Micha' in GoogleThis author has not been identified. Look up 'Odile Robach' in GoogleThis author has not been identified. Look up 'Thierry Mourier' in GoogleThis author has not been identified. Look up 'Patrice Gergaud' in GoogleThis author has not been identified. Look up 'Pierre Bleuet' in Google

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