Dario Ferreira Sanchez, Shay Reboh, Monica Larissa Djomeni Weleguela, Jean-Sébastien Micha, Odile Robach, Thierry Mourier, Patrice Gergaud, Pierre Bleuet. In-situ X-ray μLaue diffraction study of copper through-silicon vias. Microelectronics Reliability, 56:78-84, 2016. [doi]
@article{SanchezRWMRMGB16,
title = {In-situ X-ray μLaue diffraction study of copper through-silicon vias},
author = {Dario Ferreira Sanchez and Shay Reboh and Monica Larissa Djomeni Weleguela and Jean-Sébastien Micha and Odile Robach and Thierry Mourier and Patrice Gergaud and Pierre Bleuet},
year = {2016},
doi = {10.1016/j.microrel.2015.10.008},
url = {http://dx.doi.org/10.1016/j.microrel.2015.10.008},
researchr = {https://researchr.org/publication/SanchezRWMRMGB16},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {56},
pages = {78-84},
}