In-situ X-ray μLaue diffraction study of copper through-silicon vias

Dario Ferreira Sanchez, Shay Reboh, Monica Larissa Djomeni Weleguela, Jean-Sébastien Micha, Odile Robach, Thierry Mourier, Patrice Gergaud, Pierre Bleuet. In-situ X-ray μLaue diffraction study of copper through-silicon vias. Microelectronics Reliability, 56:78-84, 2016. [doi]

Abstract

Abstract is missing.