Thermal performance of 3D ICs: Analysis and alternatives

Cristiano Santos, Pascal Vivet, Jean-Philippe Colonna, Perceval Coudrain, Ricardo Augusto da Luz Reis. Thermal performance of 3D ICs: Analysis and alternatives. In 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014. pages 1-7, IEEE, 2014. [doi]

@inproceedings{SantosVCCR14,
  title = {Thermal performance of 3D ICs: Analysis and alternatives},
  author = {Cristiano Santos and Pascal Vivet and Jean-Philippe Colonna and Perceval Coudrain and Ricardo Augusto da Luz Reis},
  year = {2014},
  doi = {10.1109/3DIC.2014.7152163},
  url = {http://dx.doi.org/10.1109/3DIC.2014.7152163},
  researchr = {https://researchr.org/publication/SantosVCCR14},
  cites = {0},
  citedby = {0},
  pages = {1-7},
  booktitle = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014},
  publisher = {IEEE},
  isbn = {978-1-4799-8472-5},
}