Veikko Sariola, Quan Zhou, Heikki N. Koivo. Three dimensional hybrid microassembly combining robotic microhandling and self-assembly. In 2009 IEEE International Conference on Robotics and Automation, ICRA 2009, Kobe, Japan, May 12-17, 2009. pages 2605-2610, IEEE, 2009. [doi]
Abstract is missing.