Hideki Sasaki. Advanced Packaging Technology and Design Methodology for Next Generation Chiplets. In Yuichi Nakamura 0002, Yu Wang 0002, editors, Proceedings of the 30th Asia and South Pacific Design Automation Conference, ASPDAC 2025, Tokyo, Japan, January 20-23, 2025. pages 1144, ACM, 2025. [doi]
Abstract is missing.