Emma R. Schmidgall, Flavio Griggio, George H. Thiel, Sherman E. Peek, Bhargav Yelamanchili, Archit Shah, Vaibhav Gupta, John A. Sellers, Michael C. Hamilton, David B. Tuckerman, Samuel d'Hollosy. Reliability Characterization of a Flexible Interconnect for Cryogenic and Quantum Applications. In IEEE International Reliability Physics Symposium, IRPS 2021, Monterey, CA, USA, March 21-25, 2021. pages 1-7, IEEE, 2021. [doi]
Abstract is missing.