Challenges to realize highly reliable SiC power devices: From the current status and issues of SiC wafers

Junji Senzaki, Shohei Hayashi, Yoshiyuki Yonezawa, Hajime Okumura. Challenges to realize highly reliable SiC power devices: From the current status and issues of SiC wafers. In IEEE International Reliability Physics Symposium, IRPS 2018, Burlingame, CA, USA, March 11-15, 2018. pages 3, IEEE, 2018. [doi]

Abstract

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