Kihwan Seong, Donguk Park, Gyeom-Je Bae, HyunWoo Lee, Youngseob Suh, Wooseuk Oh, Hyemun Lee, Juyoung Kim, Takgun Lee, Geonhoo Mo, Sukhyun Jung, Dongcheol Choi, Byoung-Joo Yoo, Sanghune Park, Hyo-Gyuem Rhew, Jongshin Shin. A 4nm 32Gb/s 8Tb/s/mm Die-to-Die Chiplet Using NRZ Single-Ended Transceiver With Equalization Schemes And Training Techniques. In IEEE International Solid- State Circuits Conference, ISSCC 2023, San Francisco, CA, USA, February 19-23, 2023. pages 114-115, IEEE, 2023. [doi]
Abstract is missing.