A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications - researchr publication authors

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Shuai Shao, Dapeng Liu, Yuling Niu, Kathy O'Donnell, Dipak Sengupta, SeungBae Park. A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications. Sensors, 17(2):322, 2017. [doi]

This author has not been identified. Look up 'Shuai Shao' in GoogleThis author has not been identified. Look up 'Dapeng Liu' in GoogleThis author has not been identified. Look up 'Yuling Niu' in GoogleThis author has not been identified. Look up 'Kathy O'Donnell' in GoogleThis author has not been identified. Look up 'Dipak Sengupta' in GoogleThis author has not been identified. Look up 'SeungBae Park' in Google

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