Shuai Shao, Dapeng Liu, Yuling Niu, Kathy O'Donnell, Dipak Sengupta, SeungBae Park. A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications. Sensors, 17(2):322, 2017. [doi]
@article{ShaoLNOSP17,
title = {A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications},
author = {Shuai Shao and Dapeng Liu and Yuling Niu and Kathy O'Donnell and Dipak Sengupta and SeungBae Park},
year = {2017},
doi = {10.3390/s17020322},
url = {http://dx.doi.org/10.3390/s17020322},
researchr = {https://researchr.org/publication/ShaoLNOSP17},
cites = {0},
citedby = {0},
journal = {Sensors},
volume = {17},
number = {2},
pages = {322},
}