Robustness enhancement through chip-package co-design for high-speed electronics

Meigen Shen, Jian Liu, Li-Rong Zheng, Esa Tjukanoff, Hannu Tenhunen. Robustness enhancement through chip-package co-design for high-speed electronics. Microelectronics Journal, 36(9):846-855, 2005. [doi]

Abstract

Abstract is missing.