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Bing Shi, Ankur Srivastava. Liquid cooling for 3D-ICs. In 2011 International Green Computing Conference and Workshops, IGCC 2012, Orlando, FL, USA, July 25-28, 2011. pages 1-6, IEEE Computer Society, 2011. [doi]
Possibly Related PublicationsThe following publications are possibly variants of this publication: TSV-constrained micro-channel infrastructure design for cooling stacked 3D-ICsBing Shi, Ankur Srivastava. ispd 2012: 113-118 [doi] Micro-Fluidic Cooling for Stacked 3D-ICs: Fundamentals, Modeling and DesignBing Shi, Ankur Srivastava. ac, 88:79-124, 2013. [doi]
The following publications are possibly variants of this publication: