Bing Shi, Ankur Srivastava. TSV-constrained micro-channel infrastructure design for cooling stacked 3D-ICs. In Jiang Hu, Cheng-Kok Koh, editors, International Symposium on Physical Design, ISPD'12, Napa, CA, USA, March 25-28, 2012. pages 113-118, ACM, 2012. [doi]
Abstract is missing.