Bing Shi, Ankur Srivastava. TSV-constrained micro-channel infrastructure design for cooling stacked 3D-ICs. In Jiang Hu, Cheng-Kok Koh, editors, International Symposium on Physical Design, ISPD'12, Napa, CA, USA, March 25-28, 2012. pages 113-118, ACM, 2012. [doi]
@inproceedings{ShiS12-4,
title = {TSV-constrained micro-channel infrastructure design for cooling stacked 3D-ICs},
author = {Bing Shi and Ankur Srivastava},
year = {2012},
doi = {10.1145/2160916.2160941},
url = {http://doi.acm.org/10.1145/2160916.2160941},
researchr = {https://researchr.org/publication/ShiS12-4},
cites = {0},
citedby = {0},
pages = {113-118},
booktitle = {International Symposium on Physical Design, ISPD'12, Napa, CA, USA, March 25-28, 2012},
editor = {Jiang Hu and Cheng-Kok Koh},
publisher = {ACM},
isbn = {978-1-4503-1167-0},
}