Co-optimization of TSV assignment and micro-channel placement for 3D-ICs - researchr publication authors

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Bing Shi, Caleb Serafy, Ankur Srivastava. Co-optimization of TSV assignment and micro-channel placement for 3D-ICs. In José Luis Ayala, Alex K. Jones, Patrick H. Madden, Ayse Kivilcim Coskun, editors, Great Lakes Symposium on VLSI 2013 (part of ECRC), GLSVLSI'13, Paris, France, May 2-4, 2013. pages 337-338, ACM, 2013. [doi]

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