Bing Shi, Caleb Serafy, Ankur Srivastava. Co-optimization of TSV assignment and micro-channel placement for 3D-ICs. In José Luis Ayala, Alex K. Jones, Patrick H. Madden, Ayse Kivilcim Coskun, editors, Great Lakes Symposium on VLSI 2013 (part of ECRC), GLSVLSI'13, Paris, France, May 2-4, 2013. pages 337-338, ACM, 2013. [doi]
@inproceedings{ShiSS13,
title = {Co-optimization of TSV assignment and micro-channel placement for 3D-ICs},
author = {Bing Shi and Caleb Serafy and Ankur Srivastava},
year = {2013},
doi = {10.1145/2483028.2483131},
url = {http://doi.acm.org/10.1145/2483028.2483131},
researchr = {https://researchr.org/publication/ShiSS13},
cites = {0},
citedby = {0},
pages = {337-338},
booktitle = {Great Lakes Symposium on VLSI 2013 (part of ECRC), GLSVLSI'13, Paris, France, May 2-4, 2013},
editor = {José Luis Ayala and Alex K. Jones and Patrick H. Madden and Ayse Kivilcim Coskun},
publisher = {ACM},
isbn = {978-1-4503-2032-0},
}