Akitsu Shigetou, Tilo H. Yang, C. Robert Kao. Hydrolysis-Tolerant Hybrid Bonding in Ambient Atmosphere for 3D Integration. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-3, IEEE, 2019. [doi]
@inproceedings{ShigetouYK19,
title = {Hydrolysis-Tolerant Hybrid Bonding in Ambient Atmosphere for 3D Integration},
author = {Akitsu Shigetou and Tilo H. Yang and C. Robert Kao},
year = {2019},
doi = {10.1109/3DIC48104.2019.9058786},
url = {https://doi.org/10.1109/3DIC48104.2019.9058786},
researchr = {https://researchr.org/publication/ShigetouYK19},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019},
publisher = {IEEE},
isbn = {978-1-7281-4870-0},
}