Hsiu-Chuan Shih, Cheng-Wen Wu. An enhanced double-TSV scheme for defect tolerance in 3D-IC. In Enrico Macii, editor, Design, Automation and Test in Europe, DATE 13, Grenoble, France, March 18-22, 2013. pages 1486-1489, EDA Consortium San Jose, CA, USA / ACM DL, 2013. [doi]
@inproceedings{ShihW13,
title = {An enhanced double-TSV scheme for defect tolerance in 3D-IC},
author = {Hsiu-Chuan Shih and Cheng-Wen Wu},
year = {2013},
url = {http://dl.acm.org/citation.cfm?id=2485640},
researchr = {https://researchr.org/publication/ShihW13},
cites = {0},
citedby = {0},
pages = {1486-1489},
booktitle = {Design, Automation and Test in Europe, DATE 13, Grenoble, France, March 18-22, 2013},
editor = {Enrico Macii},
publisher = {EDA Consortium San Jose, CA, USA / ACM DL},
isbn = {978-1-4503-2153-2},
}