An enhanced double-TSV scheme for defect tolerance in 3D-IC

Hsiu-Chuan Shih, Cheng-Wen Wu. An enhanced double-TSV scheme for defect tolerance in 3D-IC. In Enrico Macii, editor, Design, Automation and Test in Europe, DATE 13, Grenoble, France, March 18-22, 2013. pages 1486-1489, EDA Consortium San Jose, CA, USA / ACM DL, 2013. [doi]

Abstract

Abstract is missing.