Temperature-Aware Sizing of Multi-Chip Module Accelerators for Multi-DNN Workloads

Prachi Shukla, Derrick Aguren, Tom Burd, Ayse K. Coskun, John Kalamatianos. Temperature-Aware Sizing of Multi-Chip Module Accelerators for Multi-DNN Workloads. In Design, Automation & Test in Europe Conference & Exhibition, DATE 2023, Antwerp, Belgium, April 17-19, 2023. pages 1-6, IEEE, 2023. [doi]

Abstract

Abstract is missing.