Conceição N. Silva, Neandra P. Ferreira, Sharlene S. Meireles, Mario Otani, Vandermi J. da Silva, Carlos Alberto Oliveira de Freitas, Felipe G. Oliveira. The Visual Inspection of Solder Balls in Semiconductor Encapsulation. In Giuseppina Gini, Henk Nijmeijer, Wolfram Burgard, Dimitar P. Filev, editors, Proceedings of the 19th International Conference on Informatics in Control, Automation and Robotics, ICINCO 2022, Lisbon, Portugal, July 14-16, 2022. pages 750-757, SCITEPRESS, 2022. [doi]
Abstract is missing.